GENERAL INFORMATION
|
|
 |
Voltages from 1 to 150 kV (AC & DC) |
| |
 |
Pulse power up to 1500 Megawatt |
| |
 |
Max. power dissipation up to 50 kW |
| |
 |
On-time from 5 ns to infinite |
| |
 |
CW frequency up to 3 MHz
(with DLC) |
| |
 |
Burst frequency up to 10 MHz |
| |
 |
Typical jitter 100 to 500 ps |
| |
 |
Isolation voltage from 20 to 200 kV |
| |
 |
Single switch, push-pull switch |
| |
 |
AC switch, AC-push-pull-switch |
| |
 |
MOSFET, IGBT & SCR technology |
| |
 |
Variable or fixed on-time |
| |
 |
TTL compatible control inputs with
Schmitt-Trigger characteristics |
| |
|
| |
 |
TTL fault signal output |
| |
 |
TTL inhibit input (not for all models) |
| |
 |
Synchron I/O (not all models) |
| |
 |
Internal clocks are synchronized with trigger for extremely low interference |
| |
|
| |
 |
No instabilities and no risk of damage at short or undefined control pulses |
|
|
|
| |
 |
Thermotrigger w. short response time |
| |
 |
Auxiliary voltage monitoring |
| |
 |
Switch frequency monitoring |
| |
 |
Active input filter for excellent EMC |
| |
 |
Minimized coupling capacitance |
| |
 |
Very low switch strayinductance |
| |
 |
LED indicators (not all models) |
| |
 |
Cost efficient plastic housing |
| |
 |
Customized housings at low costs |
| |
 |
Optional liquid cooling (ILC, DLC) |
| |
 |
Optional cooling fins (Cu, ceramic) |
| |
 |
Optional Cu cooling flange (GCF) |
| |
 |
Optional UL-94 V0 flame-retardant |
| |
 |
All
products are RoHS compliant |
| |
 |
Optional "medical certification" |
| |
|
|
| |
QUALITY
INFORMATION |
|
|
 |
Documented production processes for
maximum product quality
and reliability |
|
|
|
| |
In house SMD manufacturing line |
|
| |
Automated vapor phase
soldering process |
|
| |
Partial soldering
by own multi-axis robots |
|
| |
In house high performance CNC milling |
|
| |
In house precision CNC bending |
|
| |
100% part component desiccation |
|
| |
100% part component screening |
|
| |
100% optical inspection of every solder joint by means of
stereo microscopes |
|
|
|
| |
Machined
PCB high pressure cleaning |
|
| |
 |
Advanced plasma surface treatment |
| |
 |
Machined vacuum potting process
for 100% bubble free encapsulation |
|
|
|
|